Special Issue on Computing, Engineering and Multidisciplinary Sciences
Engineering and Science collectively played a major role in the lives we live in the 21st century. In today’s technology-driven world, engineering is the cornerstone and driver of innovation of the devices we utilize daily to improve our quality of life. The latter driver, namely the new ideas, is actually elements of research in engineering. Whereas science provides the backbone to engineering. This special section deals with the general topic of long-term innovative topics for research in Engineering and Sciences.
The peer-reviewed articles will showcase potentially high-impact research topics or directions. The objective of this issue is to identify topics that are likely to result in a noteworthy impact on the engineering industry in the next 25 to 50 years.
Topics of interest include, but are not limited to:
A. Engineering & Technology
- Architecture (A1)
- Artificial Intelligence (A2)
- Bioinformatics (A3)
- Biomedical Engineering (A4)
- Biotechnology (A5)
- Computer software and applications (A6)
- Computing (A7)
- Data Mining (A8)
- Design (A9)
- Energy (A10)
- Engineering (A11)
- Image Processing (A12)
- Information Technology (A13)
- Internet and World Wide Web (A14)
- Manufacturing (A15)
- Military studies (A16)
- Mining (A17)
- Nanotechnology and Smart Materials (A18)
- Polymers and Plastics (A19)
- Renewable & Green Energy (A20)
- Robotics (A21)
- Space Environment and Aviation Technology (A22)
- Systems Engineering (A23)
- Transport & Logistic Management (A24)
B. Physical and Life Sciences
- Agriculture (B1)
- Aquaculture (B2)
- Archaeology (B3)
- Astronomy (B4)
- Biodiversity (B5)
- Biology (B6)
- Chemistry (B7)
- Earth Sciences (B8)
- Ecology (B9)
- Environment (B10)
- GIS (B11)
- Genetics (B12)
- Meteorology (B13)
- Oceanography (B14)
- Physics (B15)
- Soil (B16)
- Waste Management (B17)
- Water (B18)
C. Health & Medicine
- Alternative Health (C1)
- Cardiology (C2)
- Dentistry (C3)
- Dermatology (C4)
- Disability and Rehabilitation (C5)
- Family Medicine (C6)
- Food Safety (C7)
- Gastroenterology (C8)
- Gerontology (C9)
- Health Education (C10)
- Infectious diseases (C11)
- Medical ethics (C12)
- Medicine and Medical Science (C13)
- Neurology (C14)
- Nursing (C15)
- Nutrition and Dietetics (C16)
- Oncology (C17)
- Palliative Care (C18)
- Psychiatry (C19)
- Public Health (C20)
- Radiology (C21)
- Reproductive Medicine and Women’s Health (C22)
- Social Work (C23)
- Surgery (C24)
- Animal Sciences (C25)
- Veterinary Science (C26)
Submission Guidelines
- For Initial Submission use pdf file and Don’t include author’s name and affiliation in the manuscript pdf file. Keep remember! DON’T INCLUDE THE AUTHOR’S NAME IN THE PDF FILE OF INITIAL SUBMISSION.
- You can download the Online Submission Guidelines for steps wise submission process.
- During Online submission, you have to select Special Issue Paper from the Track menu and then select SI on Computing, Engineering & Multidisciplinary Sciences 2023-24 in Special Issue/Selection. (Screenshot attached below)
- In cover letter section, the author must specify the topic code from A1 to C26 (minimum 1 with maximum 3) and the invitation code.
Click on “online submission” button to submit your manuscript. You have to register yourself first
Important Dates
Paper Submission Deadline: 30th April, 2024
Acceptance Notification: 4-6 week (after submission)
Publication Date: 2 weeks after acceptance
Guest Editorial Board
Guest Editor-in-Chief
- Prof. Wang Xiu Ying, Chongqing University, China
- Prof. Yo Xiao Yan, Chongqing Normal University, China
Guest Editors
- Prof. Wang Xiu Ying, Chongqing University, China
- Prof. Yu Xiao Yan, Chongqing Normal University, China
- Prof. María Jesús Espinosa, Universidad Tecnológica Metropolitana, Mexico
- Prof. Ahmad Yusairi Bani Hashim, Universiti Teknikal Malaysia Melaka, Malaysia
- Prof. Mohamed Abdelaziz Hassan Eleiwa, University of Hail, Saudi Arabia
- Prof. Nicolae Tudoroiu, John Abbott College, Canada
Publication Fee
Publishing an article in Advances in Science, Technology and Engineering Systems Journal requires Article Processing Charges that will be billed by submitting author following the acceptance of an article for publication. For the special issue, there is a special discount on publication charge of 15% as an invited article which is applicable after applying country-based discount. For more information visit the publication fee page https://www.astesj.com/publication-fee/.
Special Discount
There is a flat 35% discount (for this special issue only) on the publication fee for all the papers submitted till 15th March 2024.
Contact Information
Prof. Wang Xiu Ying
Chongqing University, China
