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Author/Affiliation: Stephan HotzOpen AccessArticle
6 Pages, 932 KB 
EMI Shielding Performance For Varies Frequency by Metal Plating on Mold Compound
Abstract:
Conformal metalization on mold compound offers new possibility for IC package design to improve features such as rigidization of the flexible core, heat sink capability, 3D-circuit patterning and the electromagnetic interference (EMI) shielding. With the unique processes, the fabrication technology had enabled to achieve the high reliable performance and had passed the electrical test. Following…
Read More(This article belongs to the SP3 (Special issue on Recent Advances in Engineering Systems 2017) & Section Manufacturing Engineering (EMF))