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Author/Affiliation: Vincent ChenOpen AccessArticle
7 Pages, 2,069 KB 
The Probe Mark Discoloration on Bond Pad and Wafer Storage
Abstract:
In this report, a probe mark discoloration with donut/circle shape was found. The corrosion formed on Aluminum bond pads. The SEM/EDS, TEM/EELS & AES surface techniques were used to identify this corrosion product. All these material analysis results pointed out the role of fluorine to this discoloration. The HAST testing, all the chip samples obtained…
Read More(This article belongs to the iraset-20 (Special Issue on Innovative Research in Applied Science, Engineering and Technology 2020) & Section Characterization & Testing in Materials Science (MCT))