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Author/Affiliation: Xuliang ZhangOpen AccessArticle
9 Pages, 984 KB 
S-Parameters Optimization in both Segmented and Unsegmented Insulated TSV upto 40GHz Frequency
Abstract:
Segmented and unsegmented 3D insulated copper through silicon vias (TSVs) of diameter 10 micro-meter, height 100 micro-meter and silicon of sizes 100 micro-meter by 100 micro-meter by 100 micro-meter are modeled using analysis system (ANSYS), equivalent circuit using advanced design system (ADS) at frequency ranges between 100MHz and 40GHz and 10MHz step size. The segmented…
Read More(This article belongs to the SP3 (Special issue on Recent Advances in Engineering Systems 2017) & Section Telecommunications (TEL))