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Keyword: BEOLOpen AccessReview
7 Pages, 2,062 KB 
Enabling 3D Heterogeneous Structures Towards Smart Chips: A Review
Abstract:
This review paper discusses recent research outcomes of fabricating three-dimensional (3D) heterogeneous structures in complementary metal-oxide-semiconductor (CMOS) integrated circuit (IC) technologies to enable smart future chips. The CMOS-based 3D heterogeneous structures demonstrated are vertical magnetic-cored inductors for radio-frequency (RF) ICs, through-back-end-of-line (BEOL) metal wall structures for global flying noise isolation, above-IC nano crossbar array electrostatic…
Read More(This article belongs to the Special Issue on Multidisciplinary Sciences and Engineering 2019-20 & Section Electronic Engineering (EEE))