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Keyword: Cross-coupledOpen AccessArticle
6 Pages, 1,518 KB 
Impact of Crosstalk on Signal Integrity of TSVs in 3D Integrated Circuits
Abstract:
Through-Silicon-Vias (TSVs) are utilized for high density 3D integration, which induce crosstalk problems and impact signal integrity. This paper focuses on TSV crosstalk characterization in 3D integrated circuits, where several TSV physical and environmental configurations are investigated. In particular, this work shows a detailed study on the influence of signal-ground TSV locations, distances and their…
Read More(This article belongs to the SP4 (Special issue on Advancement in Engineering Technology 2017-18) & Section Electronic Engineering (EEE))