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Open AccessArticle
16 Pages, 442 KB Download PDF

A Survey of Smart Hydroponic Systems

Advances in Science, Technology and Engineering Systems Journal, Volume 5, Issue 1, Page # 233–248, 2020; DOI: 10.25046/aj050130
Abstract:

The explosion in human population has left researchers scrambling for solutions on how to feed the world. Furthermore, rural-urban immigration has on the one hand left the farms in the rural areas devoid of farmers and on the other hand has left the urban areas over-populated. Hydroponics is a form of agriculture where crops are…

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(This article belongs to Section Interdisciplinary Applications of Computer Science (CSI))
Open AccessArticle
5 Pages, 403 KB Download PDF

Signal-to-Quantization Noise Ratio of the Parallel Digital Ramp Analog-to-Digital Converter

Advances in Science, Technology and Engineering Systems Journal, Volume 4, Issue 4, Page # 169–173, 2019; DOI: 10.25046/aj040421
Abstract:

This work presents a theoretical analysis of the Signal-to-Quantization Noise Ratio (SQNR) of the nonuniform Parallel Digital Ramp Pulse Position Modulator Analog-to-Digital Converter (PDR-ADC) architecture. The PDR-ADC partitions the amplitude axis into P non-overlapping partitions that sample the analog input at input signal driven instances. Samples are generated when the input signal crosses a digital…

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(This article belongs to Section Electrical Engineering (ELE))
Open AccessArticle
6 Pages, 1,518 KB Download PDF

Impact of Crosstalk on Signal Integrity of TSVs in 3D Integrated Circuits

Advances in Science, Technology and Engineering Systems Journal, Volume 3, Issue 1, Page # 109–114, 2018; DOI: 10.25046/aj030113
Abstract:

Through-Silicon-Vias (TSVs) are utilized for high density 3D integration, which induce crosstalk problems and impact signal integrity. This paper focuses on TSV crosstalk characterization in 3D integrated circuits, where several TSV physical and environmental configurations are investigated. In particular, this work shows a detailed study on the influence of signal-ground TSV locations, distances and their…

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(This article belongs to the SP4 (Special issue on Advancement in Engineering Technology 2017-18) & Section Electronic Engineering (EEE))
Open AccessArticle
7 Pages, 1,166 KB Download PDF

Impact of Line Resistance Combined with Device Variability on Resistive RAM Memories

Advances in Science, Technology and Engineering Systems Journal, Volume 3, Issue 1, Page # 11–17, 2018; DOI: 10.25046/aj030102
Abstract:

In this paper, the performance and reliability of oxide-based Resistive RAM (ReRAM) memory is investigated in a 28nm FDSOI technology versus interconnects resistivity combined with device variability. Indeed, common problems with ReRAM are related to high variability in operating conditions and low yield. At a cell level ReRAMs suffer from variability. At an array level,…

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(This article belongs to the SP4 (Special issue on Advancement in Engineering Technology 2017-18) & Section Electronic Engineering (EEE))
Open AccessArticle
5 Pages, 970 KB Download PDF

Factors Affecting the Adsorption of Trivalent Chromium Ions by Activated Carbon Prepared from Waste Rubber Tyres

Advances in Science, Technology and Engineering Systems Journal, Volume 2, Issue 3, Page # 1660–1664, 2017; DOI: 10.25046/aj0203206
Abstract:

Economic gains are generally the outcome of industrialization and consequently urbanization. However, positive fiscal index generates a negative impact on natural environment sources heaving pollutant burden on soil, air and water. Industries throw tones of contaminated water into soil and water bodies without proper treatment and create a potential threat for both living and non-living…

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(This article belongs to the SP3 (Special issue on Recent Advances in Engineering Systems 2017) & Section Biochemistry & Molecular Biology (BMB))
Open AccessArticle
9 Pages, 808 KB Download PDF

Hybrid Ontology-based knowledge with multi-objective optimization model framework for Decision Support System in intercropping

Advances in Science, Technology and Engineering Systems Journal, Volume 2, Issue 3, Page # 1363–1371, 2017; DOI: 10.25046/aj0203172
Abstract:

The problem of multi-criteria or multi-objective intercropping crop planning makes it vital to consider all related factors under the constraints that will produce the highest revenue and minimum cost. Principles of intercropping elements including soil type, plant area, plant diseases, planting and harvesting time and economics factors (e.g. price, cost) are some of the factors…

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(This article belongs to the SP3 (Special issue on Recent Advances in Engineering Systems 2017) & Section Interdisciplinary Applications of Computer Science (CSI))
Open AccessArticle
5 Pages, 1,598 KB Download PDF

Structural Optimization of Wavy FinFET for Leakage Reduction and Performance Enhancement

Advances in Science, Technology and Engineering Systems Journal, Volume 2, Issue 3, Page # 913–917, 2017; DOI: 10.25046/aj0203114
Abstract:

Wavy FinFET is a hybrid device that integrates FinFET and Ultrathin Body FET technologies on SOI platform to provide high density and drivability without causing area penalty. The problem associated with this device is higher leakage and lower threshold voltage. This problem can be solved by structural modification of the device. This work analyses the…

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(This article belongs to the SP3 (Special issue on Recent Advances in Engineering Systems 2017) & Section Electronic Engineering (EEE))

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