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Keyword: Transfer MoldOpen AccessArticle
7 Pages, 1,429 KB 
Perfect Molding Challenges and The Limitations “A Case Study”
Abstract:
Driven by today’s market demand, semiconductor is pushing towards the zero-defect direction. The improvement demanded in semiconductor manufacturing is becoming increasingly challenging. In this paper, common molding defects comprise of voids, incomplete fills, and piping holes are studied systematically, focusing on three key areas: 1) Potential mold flow weakness; 2) Molding temperature stability; as well…
Read More(This article belongs to the SP5 (Special Issue on Multidisciplinary Sciences and Engineering 2018) & Section Manufacturing Engineering (EMF))