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Keyword: HFSS
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Open AccessArticle
6 Pages, 2,411 KB Download PDF

Design and Analysis of Frequency Reconfigurable Antenna Embedding Varactor Diodes

Advances in Science, Technology and Engineering Systems Journal, Volume 4, Issue 6, Page # 371–376, 2019; DOI: 10.25046/aj040647
Abstract:

In this paper, we present a broadband frequency tunable antenna embedding varactor diodes. The reference antenna structure is a square antenna of patch dimensions [39,2 × 39,2] mm², operating at a single resonance frequency 2.45GHz. The recommended procedure to achieve the frequency shifting is to etch rectangular slots on the patch and to embed two…

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(This article belongs to Section Telecommunications (TEL))
Open AccessArticle
6 Pages, 1,178 KB Download PDF

Novel Design of Multiband Microstrip Patch Antenna for Wireless Communication

Advances in Science, Technology and Engineering Systems Journal, Volume 4, Issue 3, Page # 63–68, 2019; DOI: 10.25046/aj040310
Abstract:

This paper presents a novel six band frequency reconfigurable antenna for 2.4 GHz (Lower Worldwide Interoperability for Microwave Access (WiMAX)), 5.3 GHz (Wireless Local Area Network (WLAN)) and 9.1-10.2 GHz (X-band) frequency bands. The proposed antenna has a compact size of 22mm_30mm at lower resonance of 4.2 GHz and is printed on FR4 material with…

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(This article belongs to the isaect-18 (Special Issue on Advanced Electrical and Communication Technologies 2019) & Section Telecommunications (TEL))
Open AccessArticle
6 Pages, 1,518 KB Download PDF

Impact of Crosstalk on Signal Integrity of TSVs in 3D Integrated Circuits

Advances in Science, Technology and Engineering Systems Journal, Volume 3, Issue 1, Page # 109–114, 2018; DOI: 10.25046/aj030113
Abstract:

Through-Silicon-Vias (TSVs) are utilized for high density 3D integration, which induce crosstalk problems and impact signal integrity. This paper focuses on TSV crosstalk characterization in 3D integrated circuits, where several TSV physical and environmental configurations are investigated. In particular, this work shows a detailed study on the influence of signal-ground TSV locations, distances and their…

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(This article belongs to the SP4 (Special issue on Advancement in Engineering Technology 2017-18) & Section Electronic Engineering (EEE))
Open AccessArticle
6 Pages, 823 KB Download PDF

Design and Simulation of an RF-MEMS Switch and analysis of its Electromagnetic aspect in realtion to stress

Advances in Science, Technology and Engineering Systems Journal, Volume 3, Issue 1, Page # 76–81, 2018; DOI: 10.25046/aj030109
Abstract:

Microelectromechanical Systems (MEMS) are devices made up of several electrical and mechanical components. They consist of mechanical functions (sensing, thermal, inertial) and electrical functions (switching, decision making) on a single chip made by microfabrication methods. These chips exhibit combined properties of the two functions. The size of system has characteristic dimensions less than 1mm but…

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(This article belongs to the SP4 (Special issue on Advancement in Engineering Technology 2017-18) & Section Electronic Engineering (EEE))
Open AccessArticle
6 Pages, 1,256 KB Download PDF

RFID Antenna Near-field Characterization Using a New 3D Magnetic Field Probe

Advances in Science, Technology and Engineering Systems Journal, Volume 2, Issue 3, Page # 492–497, 2017; DOI: 10.25046/aj020363
Abstract:

In this paper the design of a new 3D magnetic field (H-field) probe with a near-field scanning system is presented, then the near electromagnetic fields radiated by a Library RFID system is characterized. The proposed system is developed in order to determine the magnetic near-field emitted by electronic devices. The designed isotropic H-field probe consists…

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(This article belongs to the SP3 (Special issue on Recent Advances in Engineering Systems 2017) & Section Telecommunications (TEL))

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