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Keyword: Packaging
Accuracy Improvement-Based Wireless Sensor Estimation Technique with Machine Learning Algorithms for Volume Estimation on the Sealed Box
Currently, the quality and quantity of product must be inspected before transporting. Currently the popular unsealing box product inspecting is performed by weighing the box where the errors occur according to the tolerance of the weighting machine and tolerance weight of the product. On the other hand, the quantity of product can be inspected automatically…
Read More Improving of Heat Spreading in a SiC Propulsion Inverter using Graphene Assembled Films
The focus of this work is first to establish the effect of the chip temperature and thermal feedback on the determination of the power loss in a three-phase propulsion inverter, then to demonstrate the possibility of achieving an improved heat spreading through the different layers inside a SiC power module by using graphene assembled films…
Read More Mission Profile Analysis of a SiC Hybrid Module for Automotive Traction Inverters and its Experimental Power-loss Validation with Electrical and Calorimetric Methods
This paper investigates the efficiency benefits of replacing the Silicon diodes of a commercial IGBT module for the main inverter application of an electric vehicle with Silicon Carbide diodes, leaving the package, operating conditions and the system unchanged. This ensures that the comparison is directly between the chip technologies without any scope for discrepancies arising…
Read More COTS – Harsh Condition Effects Considerations from Technology to User Level
Radiation hardened devices are mostly extremely expensive. The continuously downscaling of microelectronic structures and the unavoidable presence of particle radiation on ground and in space leads to unwanted failures in electronic devices. Furthermore it is expected that in the next few years around 8000 new satellites will be launched around the world. Due to the…
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