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Keyword: S-parameters
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9 Pages, 984 KB Download PDF

S-Parameters Optimization in both Segmented and Unsegmented Insulated TSV upto 40GHz Frequency

Advances in Science, Technology and Engineering Systems Journal, Volume 2, Issue 3, Page # 268–276, 2017; DOI: 10.25046/aj020336
Abstract:

Segmented and unsegmented 3D insulated copper through silicon vias (TSVs) of diameter 10 micro-meter, height 100 micro-meter and silicon of sizes 100 micro-meter by 100 micro-meter by 100 micro-meter are modeled using analysis system (ANSYS), equivalent circuit using advanced design system (ADS) at frequency ranges between 100MHz and 40GHz and 10MHz step size. The segmented…

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(This article belongs to the SP3 (Special issue on Recent Advances in Engineering Systems 2017) & Section Telecommunications (TEL))
Open AccessArticle
6 Pages, 823 KB Download PDF

Design and Simulation of an RF-MEMS Switch and analysis of its Electromagnetic aspect in realtion to stress

Advances in Science, Technology and Engineering Systems Journal, Volume 3, Issue 1, Page # 76–81, 2018; DOI: 10.25046/aj030109
Abstract:

Microelectromechanical Systems (MEMS) are devices made up of several electrical and mechanical components. They consist of mechanical functions (sensing, thermal, inertial) and electrical functions (switching, decision making) on a single chip made by microfabrication methods. These chips exhibit combined properties of the two functions. The size of system has characteristic dimensions less than 1mm but…

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(This article belongs to the SP4 (Special issue on Advancement in Engineering Technology 2017-18) & Section Electronic Engineering (EEE))

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