Segmented and unsegmented 3D insulated copper through silicon vias (TSVs) of diameter 10 micro-meter, height 100 micro-meter and silicon of sizes 100 micro-meter by 100 micro-meter by 100 micro-meter are modeled using analysis system (ANSYS), equivalent circuit using advanced design system (ADS) at frequency ranges between 100MHz and 40GHz and 10MHz step size. The segmented…

Microelectromechanical Systems (MEMS) are devices made up of several electrical and mechanical components. They consist of mechanical functions (sensing, thermal, inertial) and electrical functions (switching, decision making) on a single chip made by microfabrication methods. These chips exhibit combined properties of the two functions. The size of system has characteristic dimensions less than 1mm but…