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In this work, a representative combinational circuit is visualized in various ways. It is abstracted (concretized) from transistor level to gate level and a structure-preserving transition is carried out into a signal flow graph. For creating a signal flow plan it is necessary to swap the nodes and the edges in the signal flow graph.…

Fully Homomorphic Encryption (FHE) is considered as a key cryptographic tool in building a secure cloud computing environment since it allows computing arbitrary functions directly on encrypted data. However, existing FHE implementations remain impractical due to very high time and resource costs. These costs are essentially due to the computationally intensive modular polynomial multiplication. In…

Examples of analytical calculations of the system characteristics of the hardware and time complexity of the correlation system based on a certain number of microphones and the corresponding number of interrelations are presented. The structural solutions of the hardware special processor implementation of such class of multichannel devices for recognition and identification of types and…

This work describes computerized data acquisition system for current-voltage (I-V) characteristics of diodes. The proposed system consist of a personal computer pre-installed with LabVIEW, two units of power supply, an interface board, current and voltage sensors. Two devices under test (DUTs) are selected namely 1N4007 silicon and 1N34 germanium diodes. The current flow through the…

This paper investigates the efficiency benefits of replacing the Silicon diodes of a commercial IGBT module for the main inverter application of an electric vehicle with Silicon Carbide diodes, leaving the package, operating conditions and the system unchanged. This ensures that the comparison is directly between the chip technologies without any scope for discrepancies arising…

This paper, presents the design of a temperature sensor based on RO (Ring Oscillator) in order to make a thermal study for the detection and localization of thermal peaks in a complex system. In this work, a simulation and FPGA implementation of a fully digital temperature sensor features a number of exact inverters that can…

Through-Silicon-Vias (TSVs) are utilized for high density 3D integration, which induce crosstalk problems and impact signal integrity. This paper focuses on TSV crosstalk characterization in 3D integrated circuits, where several TSV physical and environmental configurations are investigated. In particular, this work shows a detailed study on the influence of signal-ground TSV locations, distances and their…

Microelectromechanical Systems (MEMS) are devices made up of several electrical and mechanical components. They consist of mechanical functions (sensing, thermal, inertial) and electrical functions (switching, decision making) on a single chip made by microfabrication methods. These chips exhibit combined properties of the two functions. The size of system has characteristic dimensions less than 1mm but…

In this paper, the performance and reliability of oxide-based Resistive RAM (ReRAM) memory is investigated in a 28nm FDSOI technology versus interconnects resistivity combined with device variability. Indeed, common problems with ReRAM are related to high variability in operating conditions and low yield. At a cell level ReRAMs suffer from variability. At an array level,…

The paper shows a method of transforming an asynchronously feedbacked Mealy machine into a Moore machine. The transformation is done in dual-rail logic under the use of the RS-buffer. The transformed machine stabilizes itself and is safe to use. The transformation is visualized via KV-diagrams and calculated with formulas. We will present three use-cases for…

A switched capacitor low-pass filter employing folded-cascode CMOS OP Amps with a dynamic switching bias circuit capable of processing video signals, which enables low power consumption, and operation in wide bandwidths and low power supply voltages, is proposed. In this filter, charge transfer operations through two-phase clock pulses during the on-state period of the OP…

Metal housing has been used extensively on portable communication devices such as on mobile phones and tablets.  The choice of metal housing ranges from metallic rim to metallic back cover.  This metal housing tends to improve the outlook appearance of the mobile devices, and add mechanical strength towards the mobile devices.  However, from the aspect…

Radiation hardened devices are mostly extremely expensive. The continuously downscaling of microelectronic structures and the unavoidable presence of particle radiation on ground and in space leads to unwanted failures in electronic devices. Furthermore it is expected that in the next few years around 8000 new satellites will be launched around the world. Due to the…

With the increasing integration level of electronic circuits management of the generated heat became one of the most important design aspects. Beside the semiconductor components capacitors are also affected by the elevated temperature. In this paper a new thermal characterization method is proposed adopting the thermal transient measurement technique for capacitors utilizing the capacitance itself…

This paper introduces a kind of novel backstepping phase- locked loops (PLL). The paper presents a developed theoretical model of (PLL) frequency synthesizer and provides analytical equations for calculating the desired specification such as phase margin (PM). The proposed model aims to improve the control accuracy, ensure stability and reducing the lock time. Adaptive controller…

This paper presents on-chip testing structures to characterize and detect faulty Through Silicon Vias (TSVs) in 3D ICs technology. 3D Gunning Transceiver Logic (GTL) I/O testing is proposed to characterize the performance of 3D TSVs in high speed applications. The GTL testing circuit will fire different data patterns at different frequencies to characterize the transient…

Multiprocessor Systems-on-Chip (MPSoC) allow the implementation of heterogeneous architectures with a high integration capacity. In recent years, computational requirements MPSoC are increasing exponentially. This complexity, coupled with constantly evolving specifications, has forced designers to consider intrinsically flexible implementations. Deploying applications typical of multimedia domains is difficult, not only due to the heterogeneous parallelism in the…

This work is dedicated to present a new pipeline-parallel architecture of Discrete Wavelet Packet Transform (DWPT) for all wavelet family implemented in FPGA technology. The main target of our architecture is to provide an effective performance trade-off, where it significantly increases the throughput with a restricted amount of hardware. In this article, we propose two…

The track circuits are very important equipments used in the railway transportation system. Today these are used to send vital information, to the running train, in the same time with the integrity checking of the rail. The actual track circuits have a small problem due to the use of the same transmission medium by the…

This paper presents a full wave active rectifier for biomedical implanted devices using a new comparator in order to reduce the rectifier transistors reverse current. The rectifier was designed in 0.13μm CMOS process and it can deliver 1.2Vdc for a minimum signal of 1.3Vac. It achieves a power conversion efficiency of 92% at the 13.56MHz…

Traditional CT in our industry has been limited to Business card sized samples, due to the Cone Beam x-ray systems used by Electronics manufacturing companies. Inclined or Partial CT provides a slightly different solution showing layers or slices in 2D very well, but due to the partial nature of the scans does not produce very…

Wavy FinFET is a hybrid device that integrates FinFET and Ultrathin Body FET technologies on SOI platform to provide high density and drivability without causing area penalty. The problem associated with this device is higher leakage and lower threshold voltage. This problem can be solved by structural modification of the device. This work analyses the…

High frequency planar transformer is a new type of transformer that operates at high frequency. Its significance is proved through its miniaturised features, high power density and other performances. The design of planar transformer needs to consider several fundamental factors, including core material, dimension of layers and winding pattern. As the volume decreases, extra attentions…

With silicon technology further scaling, the switching activities together with GHz operation frequency greatly affects the power integrity by generating large IR-drop noises. Excessive IR-drop causes functional failures such as timing failure, abnormal reset and SRAM flipping. The PGN needs to be optimized to reduce IR-drop. The traditional EDA optimization routine repeats the steps such…

The use of information technology is very useful for today’s life and the next, where the human facilitated in doing a variety of activities in the life day to day. By the development of the existing allows people no longer do a job with difficulty. For that, it takes a system safety home using system…